High-accuracy packaging in panel level packaging
TOKYO, JAPAN -
Media OutReach Newswire - 27 March 2025 - Toray Engineering Co., Ltd.,has developed the UC5000, a high-accuracy semiconductor packaging equipment (bonder) for panel level packaging "PLP". PLP is an advanced semiconductor packaging technology, for which there is growing demand...
Read more: Toray Engineering: Launch of UC5000 Semiconductor Packaging Equipment Compatible with Large Glass...